Integrated & Open Ecosystem
Open ecosystem design based on OCSP specifications, Server management based on OpenBMC for seamless multi-vendor
integration.
integration.
Flexible & Elastic Configuration
Up to 32 memory slots, 29 hard drive slots, and 12PCle slots to meet the most demanding expansion requirements of modern workloads.
Modular Maintenance
Quick assembly and disassembly with hot-swappable core components for easy and efficientmaintenance without total system downtime.
Technical Specifications
Standardized parameters for infrastructure planning and deployment.
Functional Highlights 1. Integrating an open ecosystem
Facing the future of intelligence and computing
An open platform based on Open BMC for server management that supports OCSP specifications; Supports the construction of memory-acceleration integrated machines with multiple single-width or dual-width GPUs; Suitable for building large-capacity warm storage; Composes tiered hybrid storage with NVMe SSDs;
2. Flexible and elastic configuration
Satisfying diverse requirements
2P and 32 Memory slots; Flexible configuration between 44 3.5-inch slots and 12 NVMe slots; Flexible configuration of 3 risers and drive bays; Select power module power based on shipment configuration;
3. Rich original factory components
Enhancing system compatibility and reliability
Motherboard and cables; Good Expander backplane support, supporting SATA/SAS/NVMe protocols; HBA card, Raid card, VROC; Provides multi-brand and multiple specification network card configurations;
4. Original design supporting OEM and ODM features
Customized HDD/SSD trays for mask and chassis logo positions; Customized BIOS and BMC; White-label silk-screening of electronic components;application scenarios 1. Infrastructure of Internet service providers
Unstructured massive data storage, distributed storage
Cloud service warm data storage
Internet data archiving and backup
Virtual tape library
2. Core storage components of intelligent computing centers and data centers
Big data warehouse
Mixed hierarchical data sources
AI comprehensive training database
3. Widely used disk arrays
Enhance disk reliability through multi-level disk Raid
Establish flash disk storage space through SAS, SATA, and NVMe to support high-speed data IO and data tiering for storageOverall dimensions (H × W × D) 174.4mm (height) × 447.4mm (width) × 828mm (depth) (excluding the safety panel) Form Factor 4U case GPU module 2 pairs of double-width
processor Supports up to 2 Intel scalable processors or Leagile ZhenDi processors, with a total of 32 DIMMs. Memory The EGS series has up to 64 cores per chip, with a maximum power of 350W and a DDR5 speed of up to 5600MT/s. back controller Low-end HBA, supports direct connection of JBOD, facilitating the implementation of SDS storage
High-performance RAID controller, supports RAID 0/1/10/5/6/50/60
Through VROC, supports NVMe RaidHard disk expansion Standard configuration: 36 large disks and 4 2.5-inch small disks. Supports 6 full-height PCIe expansion cards.
Up to 44 3.5-inch drive bays, including SATA/SAS/NVMe (U.2) storage interface:
· Front panel supports 24 3.5-inch hard drives, hot-swappable, with 6 supporting Tri-Mode
· Middle panel has 4 3.5-inch hard drives, non-hot-swappable (not standard)
· Rear panel has 12 3.5-inch hard drives, hot-swappable; can add 4 more 3.5-inch hard drives for hot-swapping (not standard)
30 3.5-inch SATA/SAS hard drives support up to 16 NVMe U.2 hard drives:
· Front panel supports 24 3.5-inch hard drives, hot-swappable, with 6 supporting Tri-Mode
· Rear panel has 12 3.5-inch hard drives, hot-swappable
· Rear panel has 10 2.5-inch hard drives, hot-swappable (not standard) all supporting Tri-Mode
Built-in SATA/NVMe M.2 slotsPCIe expansion Supports a maximum of 6 full-height expansion cards management software Integrated BMC management chip AST2600, supporting functions such as IPMI2.0, Redfish, SOL, KVM, and virtual media. network Built-in 1 Gbps dedicated management network port
Supports 2 OCP3.0 network cards
Flexible configuration of network cards through standard PCIe slotssecurity Supports intrusion detection for the chassis; supports Intel PFR3.0 and SGX2.0 security technologies; supports TCM/TPM security modules I/0 interface Standard configuration includes 1 RJ45 management network port, 1 rear VGA interface, and 4 USB interfaces (2 front, 2 rear).
Left earpiece: 2 USB 2.0 interfaces, with the option of 2 USB 3.0 interfaces.
Right earpiece: Optional smart earpiece supports 1 VGA, 1 management network port, or 1 Type-C management interface.power supply Optional 800W/1300W/1600W/2000W/2600W/2700W/3200W CRPS standard power supplies, supporting 1+1 redundancy operating temperature 0℃ to 35℃ (The working temperature support is affected by different configurations. For details, please refer to the product technical documentation.)
Architectural Scalability
Designed for the future of enterprise infrastructure, the C7460 offers unprecedented efficiency and room forgrowth. The platform architecture minimizes energy wastewhile maximizing throughput.
96% Power Supply Efficiency (80 Plus Titanium)
Flexible LOM and OCP 3.0 network options
Tool-less chassis design for rapid scalability
Architectural Applications
Versatile solutions for diverse computing environments
Data Center Virtualization
High-density cloud computing environments requiring robust CPU andmemory performance.
High Performance Computing
Supporting data analysis, scientific research, and complex simulations with
massive throughput.
Constrained Space Virtualization
Optimized for private cloud deployment in environments where physicalfootprint is limited.
Low Latency Financial
Transaction systems and high-frequency trading platforms requiring
instantaneous processing.
instantaneous processing.
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Portower Technology specializes in high-performance optical communication solutions, providing reliable and scalable products for modern data centers and network infrastructures.
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