The SMART POD liquid-cooled micro-module integrated infrastructure solution is a specialized offering within the CR6000-LC series designed for supercomputing data centers. Specifically engineered to support liquid-cooled servers, it adopts a hybrid cooling mode combining air cooling and liquid cooling. Within the servers, the primary heat source—the CPU—is cooled using liquid-cooled cold plates, while other heat sources continue to be cooled via traditional air-cooling methods. This innovative approach enables the annual average PUE (Power Usage Effectiveness) value to be reduced to below 1.1.
